EDWinXP Changelog

What's new in EDWinXP 2.10

Oct 27, 2016
  • General:
  • Implemented the efficient way to extract the List of Materials
  • Library Browser
  • Search package by no of pins
  • Library Editor:
  • Device Cutouts option
  • Library Explorer:
  • Added new libraries in Library Explorer (25% more components added)
  • Preview of components as docked view
  • Schematic Editor:
  • Dropdown list in Property Net window
  • Net Information
  • Package Preference Settings
  • List of unused components
  • Junction Point On/Off
  • Layout Editor:
  • Electra Autorouter
  • Changing all the Vias of a circuit at the same time
  • Displaying the Total length of a net
  • Implemented Jumper option for single layer routing
  • Option to choose the required trace
  • Enhanced copper pour test
  • Snap board outline by 45 degree
  • List of copper pour areas

New in EDWinXP 1.95 (Mar 12, 2015)

  • General:
  • Enhancements in Netlist / Wirelist Import & Export
  • Now EDWinXP supports 256 colors
  • Advanced ‘Edit Color Palette’ option
  • Library Editor:
  • Implemented Arc insertion in polygon
  • Incorporated an easier option to list out the user libraries while saving
  • Improved Package and Board Cabinet Views using OpenGL
  • Schematic Editor:
  • Enhancements in Block Edit option
  • Disconnect connections of a component in a single click
  • Added insertion of Arc in polygon
  • Schematic versus Layout Dual monitor visualization of components and nets
  • PCB Layout Editor:
  • Added Arc insertion in polygon
  • Layout versus Schematic visualization of components and nets
  • PCB Wizard
  • Enhanced 3D Viewer using OpenGL
  • Fabrication Manager:
  • Implemented Arc insertion in polygon
  • Improved 3D IDF Viewer using OpenGL

New in EDWinXP 1.90 (Feb 24, 2011)

  • Bug fixes:
  • Library Editor:
  • The entered thermal parameter values were displayed in wrong positions.
  • Active Layer window was not updated automatically if it is already opened.
  • Crash when we close Library Editor before closing the Active Layer window.
  • Schematic Editor:
  • While doing block load operations, a window which asks for Merging Power/ Gnd nets pops up. One can choose the option accordingly.
  • In Schematic Browser Preview, package disappears in some sequence.
  • Change in the Schematic Text sizes in System.
  • EDS:
  • EDSpice and MixMode JFET model shown difference in output voltage for the same Circuit.
  • Layout Editor:
  • While Block Relocating, the curve shaped traces were changing to straight lines at some instances.
  • If a fanout is made from a pin, reroute a trace and cancel the operation, the via will disappear.
  • Fixed problems related to Via in route and reroute options.
  • Fabrication Manager:
  • Status of grid type on toolbar was not remembered.
  • Fabrication Manager, artwork and Power GND Planes mirrored layout does not stay mirrored. Switching between layers reverts mirroring, Also not possible to print the layout in mirrored form.
  • Import/Export:
  • In Import Export Manager- OrCAD PCBII import, imported project cannot be saved.
  • The new Grid/Snap values were not updated in Import/ Export Manager.
  • Component Name in Import/ Export was limited to 15 characters which doesn't allow import of parts with longer names.
  • Electro Magnetic Analyser
  • Status of grid type on toolbar was not remembered.
  • OBB++ import:
  • ODB++ imported project cannot be saved.

New in EDWinXP 1.80 (Nov 18, 2010)

  • Schematic Editor
  • Mixed Mode Simulator
  • Layout Editor
  • Library Editor
  • Library Explorer
  • Fabrication Manager
  • General Improvements