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DipTrace Changelog

What's new in DipTrace 4.3.0.1

Aug 28, 2022
  • Built-in Spice simulator.
  • DipTrace XML for PCB, Schematic, Component Editor and Pattern Editor.
  • SMD / THT pads in PCB Layout design information.
  • Custom column title for BOM, Pick and Place.
  • New and updated component libraries with popular parts from the world and Asian brands:
  • Diodes (Rectifiers Arrays, Rectifiers Single, Schottky, Zener);
  • IC Clock & Timing Real Time Clocks;
  • IC Data Acq (ADC, DAC);
  • IC Linear (Amplifiers,Comparators);
  • IC Memory (FLASH, FRAM, SDRAM);
  • IC MCU (Atmel AVR, ST Micro ARM);
  • IC PMIC (Battery Management, Battery Chargers, Display Drivers, Gate Drivers, Motor and Fan Controllers Drivers);
  • IC PMIC (Power Distribution Switches, Supervisors Controllers Monitors, Voltage References, Voltage Regulators);
  • Isolators (Logic Output, Transistor Photovoltaic Output);
  • Opto Emitters LED SMD;
  • P&P (Filters Ferrite, TVS Diodes);
  • Relays (Power, Signal, Solid State);
  • Sensors (Angle Linear Position Measuring, Current, Humidity, Inertia Accelerometers, Temp Thermistors NTC/PTC);
  • Switches Tactile;
  • Thyristors TRIAC;
  • Transistors (Arrays, NPN, PNP, MOSFET);
  • Con (D-Sub, Edge Cards, Memory Inline Module, Memory Micro SD Card, Modular Jacks RJ-45);
  • Con (Pluggable, RF & Coaxial SMA, RF & Coaxial U.FL, Sockets PLCC, USB 2.0, USB 3.0);
  • Con Rect Headers SMD (Pitch 1.25mm Vertical Shrouded, Pitch 2.00mm Angled Shrouded);
  • Con Rect Headers THT ( Pitch 2.50mm Vertical Shrouded, Pitch 3.00mm Angled and Vertical Shrouded).
  • Basic components library (free assembly in JLCPCB):
  • Basic Parts JLCPCB.
  • Mouser Part Numbers have been added to the additional fields of the components.
  • New STEP models for patterns of the following libraries:
  • Con (Edge Cards, Memory, Sockets PLCC, USB).
  • Minor changes and bug fixes.

New in DipTrace 4.3 Beta (Mar 29, 2022)

  • Built-in Spice simulator.
  • Polishing XML for Component Editor and Pattern Editor, PCB and Schematic is on the go.
  • SMD / THT pads in PCB Layout design information.
  • New and updated component libraries with popular parts from the world and Asian brands:
  • Diodes (Rectifiers Arrays, Rectifiers Single, Schottky, Zener);
  • IC Clock & Timing Real Time Clocks;
  • IC Data Acq (ADC, DAC);
  • IC Linear (Amplifiers,Comparators);
  • IC Memory (FLASH, FRAM, SDRAM);
  • IC MCU (Atmel AVR, ST Micro ARM);
  • IC PMIC (Battery Management, Battery Chargers, Display Drivers, Gate Drivers, Motor and Fan Controllers Drivers);
  • IC PMIC (Power Distribution Switches, Supervisors Controllers Monitors, Voltage References, Voltage Regulators);
  • Isolators (Logic Output, Transistor Photovoltaic Output);
  • Opto Emitters LED SMD;
  • P&P (Filters Ferrite, TVS Diodes);
  • Relays (Power, Signal, Solid State);
  • Sensors (Angle Linear Position Measuring, Current, Humidity, Inertia Accelerometers, Temp Thermistors NTC/PTC);
  • Switches Tactile;
  • Thyristors TRIAC;
  • Transistors (Arrays, NPN, PNP, MOSFET);
  • Con (D-Sub, Edge Cards, Memory Inline Module, Memory Micro SD Card, Modular Jacks RJ-45);
  • Con (Pluggable, RF & Coaxial SMA, RF & Coaxial U.FL, Sockets PLCC, USB 2.0, USB 3.0);
  • Con Rect Headers SMD (Pitch 1.25mm Vertical Shrouded, Pitch 2.00mm Angled Shrouded);
  • Con Rect Headers THT ( Pitch 2.50mm Vertical Shrouded, Pitch 3.00mm Angled and Vertical Shrouded).
  • Basic components library (free assembly in JLCPCB):
  • Basic Parts JLCPCB.
  • Mouser Part Numbers have been added to the additional fields of the components.
  • New STEP models for patterns of the following libraries:
  • Con (Edge Cards, Memory, Sockets PLCC, USB).

New in DipTrace 4.2.0.0 (Nov 2, 2021)

  • What's new:
  • New XML format for component and pattern libraries.
  • Environment Variables in all paths, support of related project/program paths for libraries/models/pictures.
  • Ability to make a portable version of the program.
  • Pause routing (allows editing other traces/vias and resuming routing in one key press).
  • Continue routing option in net merge/move pad submenu.
  • Radial / Polar Placement of design objects in PCB Layout and Pattern Editor.
  • Group is aligned as a single object in the Align Objects feature.
  • Edge rails for a single board option.
  • Edge rail width for V-score panelizing of a rectangular board does not include the "Board to Edge/ Board to Board" gap.
  • Side and isometric view buttons in 3D preview dialogs.
  • Display/Find vias by style on the layout.
  • Submenu for creating pattern internal pad-to-pad connection (avoid accidental creation).
  • New and updated pattern libraries:
  • Con TB Headers (Pitch 3.50mm, 3.81mm, 5.00mm, 5.08mm, 7.62mm);
  • Con USB (2.0, 3.0);
  • DFN (3 Pins, 4 Pins);
  • DPAK (Pitch 1.27mm, 2.28mm, 2.29mm, 2.30mm);
  • Diodes (Axial, DFN 2 Pins, DFN 3 Pins, MELF, Molded, SOD, SOFL);
  • Fuses (Chip Inch, Chip Metric, Holders, Radial Dipped Rectangular, Radial Disk);
  • LED (Axial, Chip, Chip Corner Concave, Chip Side Concave (2,4,6 Pins), Molded (PLCC-2), Radial Round (3mm, 4mm, 5mm, 8mm, 10mm), Radial Rectangular, Radial Oval, Radial Cylindrical, SOD, SODFL, DFN, SOL (PLCC-4, PLCC-6, PLCC-8), TO Cylindrical);
  • Modules;
  • Sensors (Axial, Chip, Chip Corner Concave, DFN, DIP, Molded (PLCC-2), Radial Round, Radial Rectangular, SOD, SODFL, SOT, TO Cylindrical, Others);
  • SOT23-3 (Pitch 0.50mm, 0.65mm);
  • SOT143 (Pitch 1.30mm, 1.90mm, 1.92mm);
  • Transistors DFN 3 Pins;
  • Switches Toggle;
  • Uncategorized.
  • New and updated component libraries:
  • Con TB Headers (Pitch 3.50mm, 3.81mm, 5.00mm, 5.08mm, 7.62mm);
  • Con USB (2.0, 3.0);
  • IC MPU MCU Modules;
  • Opto Emitters LED (SMD, THT, Bi-Color, RGB, RGBW, Infrared, Ultraviolet);
  • Power & Protection Fuses (Chip Inch, Chip Metric, Holders, PTC Resettable);
  • RF Modules;
  • Sensors Optical (Photodiodes, Phototransistors, Optosensors, IC Optosensors, Photoconductive Cells);
  • Sensors Temperature (Thermistors PTC, RTD, Analog Output, Digital Output, Voltage Current Output, Thermostats);
  • Sensors Inertia (Accelerometers, Gyroscopes, Tilt Inclinometers);
  • Sensors (Magnetic, Pressure, Media Gas, Humidity, Encoders, Capacitive Touch Proximity, Image Camera, Angle Linear Position Measuring).
  • LCSC Part Numbers have been added to the additional fields of the components (used by a Chinese PCB manufacturer – JLCPCB).
  • Bug Fixes:
  • General:
  • Minimized modal windows block the program until the window is restored or closed
  • by Esc key.
  • PCB Layout:
  • In DipTrace 64-bit on Windows 10, 3D preview may get stuck when loading models.
  • The Layer Setup window may not close in rare cases, if real-time DRC is on.
  • When exporting Gerber + NC Drill, a wrong Offset may be generated.
  • Space in the project file name results in different file names in Gerber archive when
  • using <project> in filename mask.
  • Copper Pour may be temporarily filled with the wrong line width, if changed from the
  • object properties panel.
  • Default layer color setting for printing is not applied to copper pour.
  • A hole on the board border causes incorrect display in VRML export.
  • VRML models may not be included in STEP export.
  • When pressing the arrow key in the Connectivity Check Result window, selected
  • objects are moved in the design area.
  • When exporting to Eagle, the pads may be rotated 90 degrees.
  • Opening IGES models may cause the program to crash.
  • Schematics:
  • When importing Eagle files, a differential pair netclass may be imported incorrectly.
  • Renaming one Bus Connector of the group may break the connections. The check
  • and option to rename the group at once have been added

New in DipTrace 4.2 Beta (Oct 25, 2021)

  • New XML format for component and pattern libraries.
  • Environment Variables in all paths, support of related project/program paths for libraries/models/pictures.
  • Ability to make a portable version of the program.
  • Pause routing (allows editing other traces/vias and resuming routing in one key press).
  • Continue routing option in net merge/move pad submenu.
  • Edge rails for a single board option.
  • Edge rail width for V-score panelizing of a rectangular board does not include the "Board to Edge/ Board to Board" gap.
  • Side and isometric view buttons in 3D preview dialogs.
  • Display/Find vias by style on the layout.
  • Submenu for creating pattern internal pad-to-pad connection (avoid accidental creation).
  • New and updated pattern libraries:
  • Con TB Headers (Pitch 3.50mm, 3.81mm, 5.00mm, 5.08mm, 7.62mm);
  • Con USB (2.0, 3.0);
  • DFN (3 Pins, 4 Pins);
  • DPAK (Pitch 1.27mm, 2.28mm, 2.29mm, 2.30mm);
  • Diodes (Axial, DFN 2 Pins, DFN 3 Pins, MELF, Molded, SOD, SOFL);
  • Fuses (Chip Inch, Chip Metric, Holders, Radial Dipped Rectangular, Radial Disk);
  • LED (Axial, Chip, Chip Corner Concave, Chip Side Concave (2,4,6 Pins), Molded (PLCC-2), Radial Round (3mm, 4mm, 5mm, 8mm, 10mm), Radial Rectangular, Radial Oval, Radial Cylindrical, SOD, SODFL, DFN, SOL (PLCC-4, PLCC-6, PLCC-8), TO Cylindrical);
  • Modules;
  • Sensors (Axial, Chip, Chip Corner Concave, DFN, DIP, Molded (PLCC-2), Radial Round, Radial Rectangular, SOD, SODFL, SOT, TO Cylindrical, Others);
  • SOT23-3 (Pitch 0.50mm, 0.65mm);
  • SOT143 (Pitch 1.30mm, 1.90mm, 1.92mm);
  • Transistors DFN 3 Pins;
  • Switches Toggle;
  • Uncategorized.
  • New and updated component libraries:
  • Con TB Headers (Pitch 3.50mm, 3.81mm, 5.00mm, 5.08mm, 7.62mm);
  • Con USB (2.0, 3.0);
  • IC MPU MCU Modules;
  • Opto Emitters LED (SMD, THT, Bi-Color, RGB, RGBW, Infrared, Ultraviolet);
  • Power & Protection Fuses (Chip Inch, Chip Metric, Holders, PTC Resettable);
  • RF Modules;
  • Sensors Optical (Photodiodes, Phototransistors, Optosensors, IC Optosensors, Photoconductive Cells);
  • Sensors Temperature (Thermistors PTC, RTD, Analog Output, Digital Output, Voltage Current Output, Thermostats);
  • Sensors Inertia (Accelerometers, Gyroscopes, Tilt Inclinometers);
  • Sensors (Magnetic, Pressure, Media Gas, Humidity, Encoders, Capacitive Touch Proximity, Image Camera, Angle Linear Position Measuring).
  • LCSC Part Numbers have been added to the additional fields of the components (used by a Chinese PCB manufacturer – JLCPCB).
  • Bug fixes.

New in DipTrace 4.1.3.0 (Jun 10, 2021)

  • Suppliers and Prices in BOM.
  • KiCAD import has been improved (KiCAD v5.99 support).
  • Sprint Layout 6.0 Import (Text IO).
  • Minor changes and bug fixes.
  • New IPC-7351 libraries:
  • Switches (DIP, Limit, Lever, Snap Action, Pushbutton, Rotary, Slide, Tactile);
  • BGA Pitch 1.5mm;
  • DPAK Pitch (0.85mm, 1.4mm, 1.75mm, 2mm, 2.55mm, 4.57mm, 5.08mm, 5.45mm);
  • SOT23-4 Pitch (0.65mm, 0.95mm);
  • SOT223-3 Pitch (1.5mm, 2.3mm);
  • SIP Pitch (1.25mm, 1.27mm);
  • SOL Pitch 2.54mm;
  • TO-220 Pitch (1.27mm, 1.3mm);
  • Objects Logo;
  • Objects Pin Label;
  • Objects Polarity Marker.

New in DipTrace 4.1.0.0 (Feb 5, 2021)

  • Improved panelizing: V-Score and Tab Routing with mouse bites.
  • Improved BOM, BOM in PCB Layout, Interactive BOM: integrated and HTML export.
  • Improved Pick and Place: Center X/Y by component outline and terminals if exist, package height, updated dialog window.
  • Assembly variants for BOM and Pick and Place.
  • Improved Drill Size Report.
  • Automatic update of report tables in PCB (BOM, Pick and Place, Drill Size, Layer Stack).
  • Table rows and related components for report tables are highlighted.
  • Raster pictures in PCB, improved raster pictures in Schematic.
  • "Do not rotate marking with component" option.
  • Improved trace editing: sharp angles are optimized, moving orthogonal trace with related 45 degree segments if necessary.
  • Highlight copper pour islands and traces when highlight any trace or copper pour border.
  • Align components and texts by other components and texts while moving.
  • Resize of all panels (layers/properties/design manager, route, place component, etc) by mouse drag and drop.
  • Bulk update of patterns in component libraries.
  • Keep all pins of IPC-7351 3D model, not depending on pattern pads (option).
  • Pattern description is displayed in Component Editor, Schematic and PCB.
  • Basic part swap in Schematic.
  • Remove ratline while deleting trace (option).
  • 3D preview: Vector pictures in mask layer.
  • Import/Export Improvements for DXF, Eagle, Altium ASCII, P-CAD ASCII.
  • IPC-7351 Pattern Generator changes in CQFP, DFN 2 Pins, DFN 3 Pins, DFN 4 Pins, SOD, SODFL, Radial (Round LED), Radial (Rectangular LED), Radial (Disk), Radial (Disk, Offset Leads).
  • IPC-7351 automatic 3D models for the following families:
  • Crystal(HC-49); Crystal; Chip Array, 2 Side Concave; Chip Array, 4 Side Concave;
  • Oscillator, Corner Concave; Oscillator, Side Concave;
  • Chip Array, 2 Side Flat; Chip Array, 4 Side Flat; LCC;
  • Chip, Side Concave(2, 4 Pins); Chip Array, 2 Side Convex;
  • DIP Socket; SIP; TO Cylindrical; Radial (Dipped, Round); Radial (Dipped, Rectangular); Radial (Dipped, Rectangular Offset Leads);
  • Radial (Disk); Radial (Disk, Offset Leads); Radial (Inductor); Radial (Molded).
  • New libraries:
  • Con HDMI, Con Sockets DIP, Objects Fiducial, Objects Hardware Inch, Objects Hardware Metric,
  • Objects Jumper, Objects Lead Hole Pad, Objects Panelizing, Objects Testpoint, Objects Wire.
  • Old libraries redesigned for IPC-7351:
  • Con Rect Headers, Con Rect Wire to Board, Con USB, Con Vacuum Tubes, Inductors, Potentiometers.

New in DipTrace 4.1 Beta (Jan 12, 2021)

  • Improved panelizing: V-Score and Tab Routing with mouse bites.
  • Improved BOM, BOM in PCB Layout, Interactive BOM: integrated and HTML export.
  • Improved Pick and Place: Center X/Y by component outline and terminals if exist, package height, updated dialog window.
  • Assembly variants for BOM and Pick and Place.
  • Improved Drill Size Report.
  • Automatic update of report tables in PCB (BOM, Pick and Place, Drill Size, Layer Stack).
  • Table rows and related components for report tables are highlighted.
  • Raster pictures in PCB, improved raster pictures in Schematic.
  • "Do not rotate marking with component" option.
  • Improved trace editing: sharp angles are optimized, moving orthogonal trace with related 45 degree segments if necessary.
  • Highlight copper pour islands and traces when highlight any trace or copper pour border.
  • Align components and texts by other components and texts while moving.
  • Resize of all panels (layers/properties/design manager, route, place component, etc) by mouse drag and drop.
  • Bulk update of patterns in component libraries.
  • Keep all pins of IPC-7351 3D model, not depending on pattern pads (option).
  • Pattern description is displayed in Component Editor, Schematic and PCB.
  • Basic part swap in Schematic.
  • Remove ratline while deleting trace (option).
  • 3D preview: Vector pictures in mask layer.
  • Import/Export Improvements for DXF, Eagle, Altium ASCII, P-CAD ASCII.
  • IPC-7351 Pattern Generator changes in CQFP, DFN 2 Pins, DFN 3 Pins, DFN 4 Pins, SOD, SODFL, Radial (Round LED), Radial (Rectangular LED), Radial (Disk), Radial (Disk, Offset Leads).
  • IPC-7351 automatic 3D models for the following families:
  • Crystal(HC-49); Crystal; Chip Array, 2 Side Concave; Chip Array, 4 Side Concave;
  • Oscillator, Corner Concave; Oscillator, Side Concave;
  • Chip Array, 2 Side Flat; Chip Array, 4 Side Flat; LCC;
  • Chip, Side Concave(2, 4 Pins); Chip Array, 2 Side Convex;
  • DIP Socket; SIP; TO Cylindrical; Radial (Dipped, Round); Radial (Dipped, Rectangular); Radial (Dipped, Rectangular Offset Leads);
  • Radial (Disk); Radial (Disk, Offset Leads); Radial (Inductor); Radial (Molded).
  • New libraries:
  • Con HDMI, Con Sockets DIP, Objects Fiducial, Objects Hardware Inch, Objects Hardware Metric,
  • Objects Jumper, Objects Lead Hole Pad, Objects Panelizing, Objects Testpoint, Objects Wire.
  • Old libraries redesigned for IPC-7351:
  • Con Rect Headers, Con Rect Wire to Board, Con USB, Con Vacuum Tubes, Inductors, Potentiometers.

New in DipTrace 4.0.0.3 (Jul 2, 2020)

  • IPC-7351 standard pattern type:
  • pattern is generated automatically by IPC-7351 generator integrated into Pattern Editor;
  • D model is generated on the fly in Pattern Editor and PCB Layout.
  • New IPC-7351 libraries.
  • UI has been optimized for 4k monitors.
  • Mac OS 10.15 Catalina support.
  • RoundRect and D-shape pads.
  • Pad shape can be shifted from pad hole center.
  • Teardrops for pads, vias, trace width change and T-junctions.
  • Rotating pads by any angle without changing to polygon.
  • Rotating component by any angle without changing it.
  • Pad terminals.
  • Segmented paste mask, solder mask by paste mask.
  • Solder mask and paste mask of pads are visible in the design area and can be printed.
  • Fiducial object in PCB and Pattern Editor.
  • Pattern Editor has a layer panel similar to PCB Layout.
  • Both Pattern Editor and PCB Layout layer panels have configurable layer order and visibility.
  • Courtyard layer, DRC does not allow courtyard region to be overlayed (touch is allowed.
  • Component outline layer (3D model can be built by component outline.
  • Configurable Silk to Pad clearance in DRC.
  • Remove silk from pads/holes/mask wizard in Pattern Editor.
  • Place outline wizard in Pattern Editor.
  • Similar pad numbers are allowed (in this case pads are connected inside a pattern, @ symbol before or after pad number allows to avoid warning.
  • Two types of internal component connections are possible:
  • one of pads should be connected or internal connection can be used as jumper for the net;
  • all pads should be connected.
  • Manual routing improvements:
  • Routing with static vias option;
  • Tab key can be used to toggle between selection of a segment, trace and net;
  • Del key is used for unrouting selected traces (node to node instead of deleting net;
  • Delete Net option has been added to net submenu.
  • ways to build and edit arcs (3 points, center-radius-angles, start-end-radius.
  • Any set of shapes can be converted to a board outline (you can place arcs, lines, poly-lines as you wish, connect their ends and convert the set to a board outline.
  • Updated properties dialogs for all shapes (now can be edited by dimensions.
  • Obround shapes instead of ellipses in all programs.
  • Snap to other objects key points when building/editing shapes, board and copper pour.
  • Multi-line text.
  • “~” symbol is allowed in text (double ~~.
  • Text and pictures can be rotated by any angle.
  • Pictures are now vectorized and saved together with a design file.
  • It is possible to etch text or picture/logo in the copper pour.
  • Anchor point + Left-Center-Right, Top-Center-Bottom alignment is used for text, markings, pictures and while editing shapes.
  • Cut the right angle of the shape option.
  • New Component marking system in Schematic and PCB Layout:
  • any number of markings can be displayed (display property is available for each field, including additional;
  • free angle rotation and alignment;
  • separate marking settings for assembly layer in PCB;
  • custom marking font by the component;
  • text with parameter property placed in Pattern/ Component Editor is counted as pattern marking (PCB/Schematic do not add additional text;
  • font settings can be applied to markings placed in Component/Pattern Editor;
  • move tool (F10 allows to move/rotate any text object inside a component directly in Schematic/PCB.
  • Pattern origin is shown as cross + circle (options and can be displayed by layers.
  • ways of building 3D models of the pattern (by file, by component outline and by IPC-7351 standard.
  • Filter can be stopped at any search stage, results are displayed in real-time while searching components.
  • Component properties dialog is redesigned to allow display and edit all additional fields at once.
  • Name description, unique name and manufacturer fields have been added to the pattern.
  • Free resizing of library/component list and additional fields in Component/Pattern Editors.
  • Pattern shape precision has been improved, recounting pattern shapes by borders when you change the number of pads/dimensions in Pattern Editor.
  • Pad to copper pour thermals are rotated by pad/component angle.
  • Selecting object and opening its submenu from Design Manager in Schematic and PCB (right click on the item in the Design Manager.
  • Groups in Component and Pattern Editors, similar to Schematic and PCB.
  • Measure tool in Schematic and Component Editor.
  • Properties dialog windows may change locked objects after confirmation.
  • Updating PCB from Schematic keeps locked components non-existent in Schematic.
  • Export all Gerber and Drill files into a zip archive with a single click.
  • Configurable default filenames for drill export.

New in DipTrace 3.3.1.3 (Feb 20, 2020)

  • Zoom on Undo/Redo - options added, main zoom mode has been corrected.
  • Routing by Numpad option (NumLock should be ON).
  • Grid Snap option - allows to turn off snap, but keep grid visible.
  • Status Bar now displays current mode, current view (normal/mirrored) and grid snap.
  • Several bugs have been found and fixed - see details.

New in DipTrace 3.3 Beta (Oct 10, 2018)

  • Configurable precision for all values by units, configurable grid precision.
  • Improved manual routing:
  • "follow design rules" option (doesn't allow violations)
  • redesigned routing modes
  • orthogonal segments
  • fix single segment option
  • via preview at the end of routed segment
  • Redesigned Undo/Redo System in Schematic and PCB Layout
  • Impoved Hide/Display Wire feature in Schematic
  • UI: All ComboBoxes have been replaced with DropDownLists.
  • Option: detailed hint in PCB Layout and Pattern Editor (shows pad/via/hole dimensions).
  • KiCAD Schematic and PCB import.
  • KiCAD Library and Footprint import.
  • Eagle Schematic and PCB XML export.
  • Eagle Library XML export.
  • Polishing of existing features.

New in DipTrace 3.2 (Oct 26, 2017)

  • DRC same net clearance check (Trace to Trace, SMD to Pad, SMD to Via, SMD to SMD).
  • Improved highlight and selection of objects in the PCB Layout (traces and all other objects under footprints are highlighted in the default mode).
  • Polishing of length matching and meander features.
  • Storing common solder mask swell and paste mask shrink with the project file.
  • Always open/soldered option in custom mask/paste settings for pads and vias.
  • Rotate Group and Flip Group commands in the Component and Pattern Editors.
  • Additional fields in Pick and Place, tab divider in text files for BOM and Pick and Place.

New in DipTrace 3.1 (May 29, 2017)

  • Length matching rules.
  • Real-time length comparison table.
  • Layer stackup table.
  • Using layer stackup and pad signal delay for trace length and differential pair phase calculation.
  • Meander tool for any trace, easy resizing and moving of meanders.
  • Improved phase tune tool.
  • Align objects.
  • Switching measurement units with a shortcut in any dialog box (Shift+U by default).
  • Hotkeys for selecting sheets in Schematic and for the measuring tool in the Pattern Editor.
  • Moving all selected trace segments simultaneously (bus editing).
  • Permanent net highlight option.
  • Altium ASCII import (Schematic, PCB, libraries).
  • Eagle XML import (Schematic, PCB, libraries).
  • ODB++ output - version 8.1 added.
  • 11,813 new components and 345 new patterns.
  • 1,726 new 3D models.

New in DipTrace 3.0.0.1 (Apr 13, 2016)

  • Custom user-defined keyboard shortcuts for tools and dialogs.
  • ODB++ (version 7.0) manufacturing output.
  • Gerber X2 manufacturing output.
  • DRC rule details (easy editing of routing constraints).
  • Tree view of 3D models in All Models list, sorted by categories (folders).
  • Overall speed and memory optimization for large designs.
  • Optimized UI fonts.
  • 8143 new components.
  • 5694 new STEP models for 3D.
  • Differential pairs:
  • Define differential pair and its rules;
  • Automatic or manual defining of paired pads;
  • Paired routing and editing of differential pair;
  • Single-track differential pair routing and editing;
  • Phase tune tool (place custom / regular size meanders);
  • Real-time control of phase and length tolerance;
  • Differential pair manager;
  • Support of differential pairs for external autorouters, recognition of paired traces.

New in DipTrace 2.9 Beta (Aug 12, 2015)

  • Basic differential pair tools (define differential pair, route / edit / neck-down differential pair, and DiffPair Manager).
  • Custom user-defined keyboard shortcuts for tools and dialogs.
  • ODB++ (version 7.0) manufacturing output.
  • Gerber X2 manufacturing output.
  • DRC rule details. Each error comes with details on where to edit target values.
  • Speed optimization for large designs.
  • Optimized UI fonts.

New in DipTrace 2.4.2.0 (Aug 11, 2014)

  • Redesigned UI.
  • Unicode support in all program objects, files and UI elements.
  • STEP export of PCB 3D model.
  • STEP and IGES import of package 3D models.
  • IPC-D-356A Netlist Export.
  • BSDL Pinlist Import in Component Editor.
  • Updated import dialogs of third-party schematics and net-lists, remembering of attached patterns.
  • Printing multipage schematic as single document.
  • Updated Title Block Editor, "Attached Pattern" tool, editing of polygonal pads.
  • Redesigned Properties panel (on design area) for Component and Pattern editors.
  • Zooming / Panning with mouse wheel in all print / import / export panels with preview feature.
  • Update all Copper Pours and algorithm optimizations (approx 3x-5x speed-up).
  • Correct side changing for groups in PCB Layout.
  • New library management system:
  • Library Groups;
  • Standard and user libraries are separated to different groups, standard libraries can not be changed by user;
  • Project libraries and design cache;
  • Cross-module Library Manager;
  • Dynamic update of library groups, group content, active library / component between programs;
  • Filter feature with customizable number of parameters (search by current library, group or all libraries).

New in DipTrace 2.3.1.0 (Mar 20, 2013)

  • Importing Schematics from EDIF (OrCAD).
  • Existing features were polished and known bugs in 2.3 have been fixed.

New in DipTrace 2.3.0.0 (Oct 20, 2012)

  • Online DRC - dynamically checks design rules while you add objects, route traces or edit anything in layout. Static DRC check was improved and optimized.
  • 3D VRML 2.0 Export of PC board. Allows you to export solid body of your board with models to mechanical CAD.
  • Custom Non-Signal layers.
  • Arranging PCB components by hierarchical blocks. Copying routing/placement between similar blocks.
  • Automatic showing/hiding ratlines for copper pours depending on pouring areas and traces ("Hide Net Ratlines" option has been removed).
  • Pour priority for copper pour.
  • Separate "Place Ratline" mode, no more ratlines in "default" and "edit traces" modes.
  • "Manual Route" mode hot-key (~).
  • Configuring and saving file names for Gerber export by layers (name and extension for each layer).
  • Exporting dimensions into Gerber and DXF.
  • Checking pin/wire superimposing without connection in Schematic ERC.
  • Saving connections without wires while copying/pasting parts in Schematic.
  • Moving objects between pages in Schematic.
  • Rearranging sheets in Schematic.
  • Saving "open/save dialog" initial folders by file type (globally for all programs).
  • Blocking file by the program while editing it. Overwriting by second/network appearance is prohibited.
  • Backward compatibility of binary file formats starting from this version (it can open files of further versions).
  • Windows 8 compatibility.
  • Ordering engine has been added (see File/Order PCB).
  • Online check for new versions and DipTrace news.
  • Library update: 8000+ new components, euro symbols, new patterns.

New in DipTrace 2.2.0.0 (Sep 15, 2011)

  • 3D Preview in PCB Layout (.wrl and .3ds models are supported).
  • 2580 3D models in .wrl format (separate download).
  • Redesigned pattern and component libraries (full conformity).
  • Strict Via Styles (changing via style changes all vias of the style).
  • Net Classes (with extended rules). Class-to-Class rules.
  • Improved DRC (more rules, separate rules by layers and net-classes, class-to-class rules). Show errors by layers or all. Show current clearance/size and necessary.
  • All necessary dialog boxes and menus are redesigned to use net classes and via styles.
  • Main menu redesigned (Layers item removed, sub-items moved to layers panel and Route menu).
  • Inserting layers, moving layers up/down.
  • Layer panel improved (buttons to add layer, layer setup and display mode; submenu; set current layer by double click)
  • Layer Setup dialog box improved (insert layer, move up, move down).
  • Improved manual routing:
  • 3 standard modes + custom mode;
  • 7 possible segment configurations;
  • fixed degree step for free/curve modes;
  • highlight only routed net option;
  • current via style option;
  • all options and hotkeys are listed on properties panel;
  • different trace width by layers (from net class rules).
  • Improved editing traces:
  • selecting several segments at once and changing properties;
  • adding nodes with hotkey (no mouse click or selecting item is necessary);
  • changing all from properties panel;
  • more hotkeys (all lised in submenu and properties panel).
  • Oval holes in pads (slots).
  • Identical component/net naming in hierarchical schematic and PCB.
  • Global nets for hierarchy (net-ports and connecting by name can be used in hierarchy).
  • Update PCB from Hierarchical Schematic by components (no similar RefDes inside hierarchy needed).
  • Easy connecting/disconnecting wires to/from nets by names, automatic changing text object with net name by the nearest wire.
  • Making wires is similar to PCB manual routing (automatic or 2 segment configurations).
  • NC Drill Import, combining it with Gerber import to get pads with holes.
  • Correct NC drill export for blind holes (by layer pairs).
  • PADS ASCII import in component and pattern editor, PADS ASCII schematic import.
  • Properties/Layers panel auto-switch when select tool or objects, more properties by objects.
  • Objects highlight option separate from displaying on Objects tab.
  • RefDes renumbering (see Tools/RefDes Renumbering in main menu or RefDes Renumbering in component submenu).
  • Jumper wires layer (see View/Jumper Wires)
  • Making polygons, board outline and copper pours is similar to each other.
  • More drill symbols (characters added). Comment table for drill symbols.
  • Back annotate of net names and net classes (PCB > Schematic).
  • Save/Load Settings (Classes,Styles,Layers,DRC,etc.) in PCB, Loading Classes in Schematic.
  • Paste/Mask Settings for pads in Pattern Editor.
  • Displaying ratlines for moved components only (option in PCB, turned on by default).
  • Converting vias: static to "part of trace" and back.
  • Placing new components outside board outline when updating PCB from Schematic.
  • Vector/True Type font in BOM, hierarchical RefDes similar to PCB.
  • Copy/Paste, Matrix copy speed optimization.
  • Many UI improvements.

New in DipTrace 2.1.0.0 (Feb 11, 2010)

  • New high-class shape-based auto-router.
  • Dimensions in PCB Layout and Pattern Editor (horizontal, vertical, free, radius, pointer).
  • Saving all settings with project file.
  • Placing board cutout, copper objects and route obstacles in Pattern Editor.
  • Changing shape line width in pattern editor.
  • Placing polylines and polygons in pattern editor.
  • Converting polygons to pads and back in pattern editor.
  • DXF import was improved in pattern editor ("all layers" and "fill closed areas").
  • TrueType for pin names/pin numbers/net names in Schematic (option).
  • Removing similar holes in drill files.
  • Searching and displaying holes by size.
  • Rectangle with rounded corners board outline in board points dialog box.
  • View/Objects tab on the design manager panel. "Copper Pours" item has been added.
  • Redesigned Print Preview in PCB Layout.
  • Resizable pin manager and attached pattern dialog boxes in component editor.
  • Quick buttons on component properties panel in component editor.
  • Changing font of pin names in component editor or schematic.
  • Pin Properties dialog box in Schematic.
  • Changing grid size with "Ctrl+" and "Ctrl-". "+" and "-" are used for scale in all programs. "R" or Space for rotating in all programs.
  • "IC - 4 sides" component type in component editor.
  • Only x position of horizontal pins is changed when you change width, and y position of vertical pins if change height of IC. Other properties are not changed.
  • Rectangle and Zig-Zag pattern types in pattern editor.
  • Lock properties button in component and pattern editors.
  • Displaying library of component and "Place into Current Position" button in Search window of Component and Pattern editors.
  • Block Delete (select several components and delete) and Block Insert (right click/Insert Components from library) components/patterns in Component and Pattern Editors.
  • Library verification features in Component and Pattern Editors.
  • Finding component in active/opened library (all programs).
  • Sorting pins in pin manager by name, number and position.
  • Repositioning pins by name or number in component editor.
  • Group Rotate and Flip features in Component Editor (pin submenu; Shift+R, Shift+F hot-keys).
  • Internal connections are red and can be removed by repeated creation - in Component Editor/Attached Pattern
  • Displaying pad numbers in Pattern Editor, Pcb and Component Editor.
  • Default Net Width check while updating pcb from schematic, saving net properties from pcb (route mode, hidden connections, etc.).
  • Data and document files were moved to AppData and MyDocuments. Does not write anything to Program Files (Vista/Win 7 compatibility).
  • P-CAD ASCII, PADS Import/Export Improved
  • P-CAD ASCII, Eagle Script libraries import improved
  • OrCAD MIN Interchange Import/Export in PCB Layout
  • Origin can be placed by object key-points.
  • "Change Symbol Type" feature in Component Editor (automatic making 2sided/4sided symbol from existing one).
  • Making busses by pin names in Component Editor.
  • "No thermal for vias" and separate thermal settings for SMD in copper pour properties (no need to use pad/via custom thermal settings).
  • Printer calibration in PCB Layout.
  • Exclude some objects from panelizing, saving panelizing settings with layout file.
  • Dimensions are displayed for pattern types in pattern editor.
  • It is possible to change type properties for rotated pattern in Pattern Editor.
  • RefDes numeration for hierarchy changed (U1_1, U1_2, etc.).
  • Additional check if attached patterns are correct for multipart components while exporting net-list or saving file.
  • ArcMode is turned off automatically after placing arc in board outline.
  • Placing pattern markings over pads/vias/traces.
  • Graphics speed in PCB Layout, Component and Pattern Editors was optimized.
  • Recovery options (number of steps between auto-savings and enabling/disabling recovery).
  • Text type (RefDes, Name. Value) in Pattern Editor.
  • Copper pour fill counts internal copper pours.
  • UI polishing.
  • 16000+ new components, existing libraries were redesigned by new standards.

New in DipTrace 2.0.01 (Feb 24, 2009)

  • Properties panel in PCB Layout and Schematic
  • Display/Hide layers in PCB Layout
  • Design Manager
  • Fanout
  • Hierarchical Schematic
  • Custom color for the net
  • Direction arrows for wires in Schematic
  • Thermal support in DXF Edge function
  • Arc traces in PCB Layout
  • Text in pattern editor
  • Unroute line command in PCB Layout
  • Make connection from trace end while routing (D3d and OpenGL modes).
  • Lock net structure in PCB Layout
  • Manual routing improved
  • Copy/paste works between instances
  • Internal connections in component pattern.
  • Panelizing of different PCBs on the same panel.
  • P-CAD ASCII Import/Export in Schematic and PCB Layout.
  • PADS ASCII 2005 Import/Export in PCB Layout.
  • 8000+ new components

New in DipTrace 1.50 (Mar 14, 2008)

  • DirectX/OpenGL support (faster drawing on large Schematics/PCBs)
  • Vector font
  • Panelizing
  • Copper pour island removal (internal, unconnected).
  • "Snap copper pour to board outline" option.
  • "Black and White only" print option.
  • Selecting/Deselecting objects by types, layers, etc.
  • Displaying hidden wires in schematic.
  • Connect shape to net in PCB Layout (DRC, copper pours, etc.)
  • Copy/Paste shortcuts in component/pattern editor component properties panel
  • Change incorrect polygonal pads automatically.
  • Traces box in DXF export dialog box.
  • "Fill closed areas" option for DXF import ( using embedded polygons as cutouts).
  • Shift to make shapes orthogonally.
  • Converting cutout shapes to board outline option.
  • Bulk connection for pads/vias in PCB Layout.
  • Correct trace/connection alignment for center-free polygonal pads
  • Forbid jumpers under components option for auto-router.
  • Hide table borders option.
  • Redesigned grid view for small scale.
  • "Different grid step for Y" option.
  • Highlight optimization (reducing CPU time).
  • Row number and total quantity in BOM.
  • Forcing correct extension while saving files.
  • "Do not display hint" option.
  • Scaling schematic and titles to page while printing.
  • Multiple edge passes option in DXf Export.
  • Changing width of components/patterns panel.
  • "Disable automatic wire routing" option in Schematic.

New in DipTrace 1.50 Beta (Jan 23, 2008)

  • DirectX/OpenGL support (faster drawing on large Schematics/PCBs)
  • Vector font
  • Panelizing
  • Copper pour island removal (internal, unconnected)
  • "Snap copper pour to board outline" option
  • "Black and White only" print option
  • Selecting/Deselecting objects by types, layers, etc
  • Displaying hidden wires in schematic
  • Connect shape to net in PCB Layout (DRC, copper pours, etc.)
  • Copy/Paste shortcuts in component/pattern editor component properties panel
  • Change incorrect polygonal pads automatically
  • Traces box in DXF export dialog box
  • "Fill closed areas" option for DXF import
  • Shift to make shapes orthogonally
  • Unhide wire option in Schematic
  • Converting cutout shapes to board outline option
  • Bulk connection for pads/vias in PCB Layout
  • Correct trace/connection alignment for center-free polygonal pads
  • Forbid jumpers under components option for auto-router
  • Hide table borders option
  • Redesigned grid view for small scale
  • "Different grid step for Y" option
  • Highlight optimization (reducing CPU time)
  • Row number and total quantity in BOM
  • Forcing correct extension while saving files
  • "Do not display hint" option

New in DipTrace 1.40 (May 25, 2007)

  • Component placement by list, arrangement in PCB Layout
  • Auto-placement
  • Spice options in Schematic and component editor, exporting net-list for LT Spice.
  • File formats extending (floating point values are more accurate, etc)
  • Library path in component/pattern properties, automatic update
  • Custom colors for printing
  • Creating traces and wires from empty area
  • Route/Unroute traces for selected components
  • Create list of additional fields in PCB Layout or Schematic
  • Unlimited number of grids
  • Assembly options
  • Snap components to grid by origin
  • SMD pads on both sides for the same component
  • Pattern can have Mask, Paste, Assy shapes on both sides
  • Top side is invisible while editing inner layer
  • Changing pattern name in schematic without attaching pattern (for net-lists).
  • Changing default line width for shapes in PCB and Schematic
  • Selecting traces separately in PCB Layout
  • Selecting of visible objects only for box selection
  • Menu (Warning) when trying to change net structure
  • Displaying net names above the wires
  • Export All option in Gerber dialog box
  • DRC - control min ring size and max drill size
  • Automatic Text flip for Bottom side option
  • Import Schematics and PCBs from Eagle
  • String Grids can be edited directly (additional fields, pin numbers, etc).
  • Export Drill files for through and blind holes separately
  • OrCad TAP drill files export
  • Updating PCB from related schematic in one click ( key shortcut)

New in DipTrace 1.23 (Apr 5, 2006)

  • Custom thermals for pads.
  • Sorting in Component and Pattern Editors.
  • 'Zoom Extents" tool in Schematic and PCB.
  • Separate scale and position for Schematic pages.
  • Checking net connectivity feature.
  • "Save to File" button in schematic comparison dialog box.
  • "Paste sub-menu" by right click in design area.
  • Raster and Font vectorization for gerber was improved.
  • Unlimited zoom in Gerber and N/C drill preview.
  • Separate selection of each wire of net or bus in Schematic.
  • Moving vias and "add node" features were improved.
  • Renaming and Deleting nets in connection manager.
  • PopUp menu when trying to merge nets in PCB.
  • Returning origin to default position feature.
  • Editing wire nodes in Schematic was improved.
  • Printing negative in PCB Layout.
  • "R" or "Space" to rotate part text while moving (F10).
  • "Apply to" options for pad properties dialog box.
  • Selection of overlapping objects by repeated clicks.
  • Import P-CAD PDIF in Schematic and PCB.
  • Import Eagle Script and P-CAD ASCII library formats.